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Micron

Introducing the World’s First 232-Layer 3D NAND

Micron’s 232-layer 3D NAND — the industry’s most advanced, now shipping.

Micron’s 232-Layer NAND: The Foundation for a New Wave of End-to-End Innovation

NAND is essential for keeping up with the insatiable demand for high-performance, responsive storage — from massive data centers to the smallest devices. Micron extends NAND leadership with the next-generation 232-layer NAND technology that will enable faster, higher-capacity storage solutions.

First to Market, Second to None: the World’s First 232-Layer NAND

Micron established NAND technology leadership in 2020 with the announcement of the first 176-layer 3D NAND. Micron extends this leadership with the availability and commercial ramp of the next-generation 232-layer NAND technology.

Micron NAND Technology: Innovation and Leadership Extended

NAND is essential for keeping up with the insatiable demand for high-performance, responsive storage — from massive data centers to the smallest devices. Micron extends NAND leadership with the next-generation 232-layer NAND technology that will enable faster, higher-capacity storage solutions.

Micron NAND Technology: Innovation and Leadership Extended

Delivering even denser storage and NAND design innovations provide new levels of performance and density for uses from edge to cloud.

What Can You Do With 232 Layers?

Micron CVP and GM, Jeremy Werner, and Pure Storage VP and GM, Bill Cerreta, sat down with industry analyst, Patrick Moorhead, to talk about Micron's new 232-layer NAND. They discussed whether layers or density matter more, how NAND can help address increasing demands on storage, and some use cases for 232-layer NAND.

Market Segments

Client

Thin and light mobile laptop designs must balance the needs of peak performance, long-lasting battery life and sleek form factor options. Thanks to package size reductions of up to 28% over previous generations, Micron 232-layer NAND customers don’t have to compromise storage capacity for mobility and portability when using thin, light laptops.

Data Center

Micron’s 232-layer NAND offers data centers high-performance, high-capacity, high-density storage at improved energy efficiently per bit than prior generation NAND. These are critical advancements for data center operators who must balance constantly growing volumes of data while also meeting power, real estate and sustainability initiatives.

Mobile

Micron’s advanced process technology enables NAND flash memory innovation that paves the way for mobile storage solutions optimized for space-constrained and power-conscious mobile end-user devices. Micron 232-layer NAND will allow low-power applications to provide seamless experiences while users multitask, download or access their favorite content

Intelligent Edge

The smaller physical footprint, increased density and low power consumption of 232-layer NAND intersect with the emerging demand for faster, smaller, power-efficient storage at the edge. With high-capacity, power-efficient storage at the edge, we will see greater innovation and demand for storage across a number of new applications and services.

Datasheets


Download the AI and Machine Learning Demand Fast,Flexible Infrastructure (PDF).

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Download the Micron® DDR5 SDRAM: (PDF).

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Download the Collaboration of Giants Brings Great Value (PDF).

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Download the The Demand for High-Performance Memory (PDF).

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Download the The Rise of Smart Manufactoring (PDF).

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